SAMs Modeling Symposium - Chicago ACS - 8/2001



 Dear Colleague:
      This note is to invite you to participate in the symposium:
        Computational Modeling and Simulation of Self-Assembled Materials
         222nd National American Chemical Society Meeting in Chicago, IL
                                August 26-30, 2001
            Sponsored by the Division of Colloid and Surface Chemistry
              Co-Sponsored by the Division of Computers in Chemistry
                      and the Division of Fluorine Chemistry
      The symposium will be focused on the computational modeling and simulation
 of self-assembled materials such as self-assembled organic monolayers,
 multi-layer films, and polymers.  Contributions are requested which cover a wide
 range of chemistries including hydrocarbon, fluorocarbon, silane-based, mixed
 chemistry and more.  The modeling of materials as freestanding films and
 membranes as well as on substrates is of interest.  Papers are requested for the
 symposium, which will cover a wide-range of molecular compounds, synthetic
 polymeric materials, biological compounds, and biopolymers.   Contributions
 focused on self-organization involving both polymeric sidechains and/or
 backbones are of great interest.  Papers are also requested employing a wide
 range of methodologies including for example atomistic molecular modeling and
 simulation approaches, mesoscale approaches, and more.
      In addition to presentations during the ACS meeting we plan to organize a
 group social event to allow for greater interaction of participants.  We are
 also planning on publishing the proceedings in an ACS or other appropriate
 review series.  Complementing the Computational Modeling and Simulation
 Symposium in the Colloids and Surfaces Division will be symposia on Gels and
 Self-Assembled Films, Advances at the Solid Liquid Interface, and Advanced
 Membrane Materials.
      Attached could you please find the formal Call for Papers.  In addition
 could you please feel free to contact either of us for any additional
 information.  Thank you very much.
      With best regards,
      Mario Blanco                             Rick Ross
      California Institute of Technology            3M Company
      co-organizer                             co-organizer
      mario &$at$& wag.caltech.edu                    rbross &$at$& mmm.com
      (See attached file: SAMS_announc.doc)